1. MEMS: An abbreviation of "Micro Electro Mechanical Systems" which are devices having micron-level mechanical structures such as collecting sensors and actuators that are integrated with electronic circuitry.
2. WB-OAS (Wideband-Off-Axis Scope): Optional function that provides a wide-range of alignment light wavelengths to the OAS for wafer alignment. By covering the wavelength band from the visible light to the infrared, it is possible to perform stable alignment in most display and color-filter processes and in a backside illumination sensor process, it is also possible to align marks on the back side of a silicon wafer.
3. LOX (Low-Oxygen Exposure): Optional stepper function that reduces the oxygen concentration in the wafer lens area, which can increase photoresist reaction sensitivity and reduce required exposure doses which in turn improves overlay accuracy and productivity.
4. EAGA (Extended Advanced Global Alignment): Optional stepper function to correct for "nonlinear overlay error components" that cannot be corrected using standard AGA sampling and linear compensation. EAGA enables shotby-shot direct position measurement for all exposure fields to improve overlay accuracy.
5. IoT: Internet of Things